The next generation of pluggable optics demands far more than standard housings. For OSFP 800G+ modules, efficient thermal dissipation is critical to stable performance and reliability. While Zamak 3 housings have been the industry standard, their thermal conductivity (100–113 W/m·K) is no longer sufficient. That’s why we focus on copper (≈400 W/m·K) and high thermal alloys such as 6063 aluminum (180–200 W/m·K), delivering the advanced thermal management needed for today’s highest-power OSFP platforms.
High-Thermal Materials for OSFP 800G+
Thermal dissipation is now the limiting factor in OSFP design. Using copper or high-conductivity alloys significantly reduces heat buildup compared to traditional housings, allowing for:
● Stable performance under maximum power loads
● Longer component life and reduced risk of thermal throttling
● Greater design flexibility for engineers working on compact high-density systems
● Stable performance under maximum power loads
● Longer component life and reduced risk of thermal throttling
● Greater design flexibility for engineers working on compact high-density systems
Experience in High-Performance OSFP Housing Design
With years of expertise in thermal engineering and pluggable housing development, our team has supported global leaders in achieving breakthrough performance in high-power OSFP designs. Our strengths include:
● Proven track record delivering custom OSFP housings optimized for power-dense modules
● Thermal validation testing and iterative design improvements to meet customer performance targets
● Material expertise in copper, aluminum, and hybrid solutions to balance cost and performance
● Proven track record delivering custom OSFP housings optimized for power-dense modules
● Thermal validation testing and iterative design improvements to meet customer performance targets
● Material expertise in copper, aluminum, and hybrid solutions to balance cost and performance
Design Flexibility for Every OSFP Variant
We support a wide range of OSFP housing designs, tailored for next-generation needs:
● All OSFP types: standard OSFP, OSFP-RHS (Riding Heat Sink), OSFP-XD (Extended Density/Extended Design), and more
● Integrated cooling solutions: copper folding fins, zipper fins, embedded heat spreaders, and vapor chamber integration for maximum thermal efficiency
● Prototyping to scale: rapid prototyping for design validation and full-scale mass production with consistent quality across large volumes
● Integrated cooling solutions: copper folding fins, zipper fins, embedded heat spreaders, and vapor chamber integration for maximum thermal efficiency
● Prototyping to scale: rapid prototyping for design validation and full-scale mass production with consistent quality across large volumes
Applications in Next-Generation Networking
Our high-performance housings are built for OSFP 800G and beyond, supporting applications in:
● Cloud data centers
● AI/ML infrastructure
● Telecom backbone networks
By combining advanced materials with strong thermal design expertise, we ensure our customers stay ahead in the race for higher bandwidth and energy efficiency.
● Cloud data centers
● AI/ML infrastructure
● Telecom backbone networks
By combining advanced materials with strong thermal design expertise, we ensure our customers stay ahead in the race for higher bandwidth and energy efficiency.
