Breakthrough 6063 Casting for High-Power QSFP-DD and OSFP Housings

The main challenge in QSFP-DD and OSFP housings today is efficient thermal dissipation. Traditionally, Zamak 3 (100-113 W/m·K) is used, but it falls short for the latest high-power QSFP-DD and OSFP modules. To address this, we’ve developed an innovative casting process for 6063 aluminum (180–200 W/m·K), offering significantly improved thermal performance while maintaining competitive pricing.

In conventional aluminum die casting, silicon is typically added to improve castability. However, silicon reduces thermal conductivity, making it unsuitable for high-power applications. For these cases, we use low-silicon aluminum, such as 6063. Through our advanced techniques, we’ve overcome the challenges of casting 6063, achieving low porosity and excellent surface quality, ideal for high-performance thermal applications.